Micro Switch House Application

Micro Switch House Application Customized with Special Lever has a small contact interval and a quick action mechanism, and the contact mechanism for switching action with the specified stroke and force is covered by the shell, and there is a transmission on the outside, and the shape is small

Model:HK-14-1-10A-401

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Product Description

WEIPENG® is a leading China Micro Switch House Application Customized manufacturers, suppliers and exporter.

Tongda Micro Switch House Application Customized Introduction

Micro switch is a contact mechanism with a small contact interval and quick action mechanism, with the specified stroke and the specified force for switching action, covered with a shell, and its outside has a drive rod of a switch, because the contact spacing of the switch is relatively small, so the name micro switch, also known as sensitive switch.

Tongda Micro Switch House Application Customized Application

It can realize the automatic control of electronic products, and also realize the safety protection of electronic products. At present, microswitches have been widely used in electronic products, instrumentation, household appliances and other fields, and also have very important applications in aerospace, aviation, missiles and other national defense and military fields.

Tongda Micro Switch House Application Customized Parameter (Specification)

Switch Technical Characteristics:
ITEM	Technical Parameter		Value
1	Electrical Rating		5（2)A/10A/16(3)A/21（8）A 250VAC
2	Contact Resistance		≤30mΩ Initial value
3	Insulation Resistance		≥100MΩ (500VDC)
4	Dielectric Voltage	Between non-connected terminals	1000V/0.5mA/60S
		Between terminals and the metal frame	3000V/0.5mA/60S
5	Electrical Life		≥50000 cycles
6	Mechanical Life		≥1000000 cycles
7	Operating Temperature		-25~125℃
8	Operating Frequency		electrical :15 cycles Mechanical :60 cycles
9	Vibration Proof		Vibration Frequency : 10~55HZ; Amplitude :1.5mm; Three directions :1H
10	Solder Ability : More than 80% of immersed part shall be covered with solder		Soldering Temperature :235±5℃ Immersing Time :2~3S
11	Solder Heat Resistance		Dip Soldering :260±5℃ 5±1S Manual Soldering : 300±5℃ 2~3S
12	Safety Approvals		UL、CSA、VDE、ENEC、TUV、CE、KC、CQC
13	Test Conditions		Ambient Temperature :20±5℃ Relative Humidity :65±5%RH Air Pressure :86~106KPa