Micro Switch Data Center Micro Pressure Switch

Micro Switch Data Center Micro Pressure Switch has a small contact interval and a quick action mechanism, and the contact mechanism for switching action with the specified stroke and force is covered by the shell, and there is a transmission on the outside, and the shape is small

Model:HK-14-W-585

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Product Description

WEIPENG ® is one of the leading in the manufacturing suppliers and exporter of Micro switches in China

Tongda Micro Switch Data Center Micro Pressure Switchl Introduction

Micro switches, also known as snap action switches, are small electromechanical devices commonly used in various appliances, vehicles, machinery, and electronic devices.They are employed in fuel dispensers and petrol stations, providing control and feedback for fuel pump functions.They are used in packaging machinery, ensuring reliable control and operation.

Tongda Micro Switch Data Center Micro Pressure Switch Application And Feature

Micro switches are widely used in various fields. The following are several main application areas: Electronic equipment: Micro switches are often used in electronic equipment. They can be used to control power switches, function keys, volume buttons, and more. Home appliances:such as TVs, air conditioners, washing machines, refrigerators, etc.

In conclusion, micro switches have important applications in many fields and can play a key role in control, sensing and protection.

Switch Technical Characteristics:
ITEM	Technical Parameter		Value
1	Electrical Rating		5（2)A/10A/16(3)A/21（8）A 250VAC
2	Contact Resistance		≤30mΩ Initial value
3	Insulation Resistance		≥100MΩ (500VDC)
4	Dielectric Voltage	Between non-connected terminals	1000V/0.5mA/60S
		Between terminals and the metal frame	3000V/0.5mA/60S
5	Electrical Life		≥50000 cycles
6	Mechanical Life		≥1000000 cycles
7	Operating Temperature		-25~125℃
8	Operating Frequency		electrical :15 cycles Mechanical :60 cycles
9	Vibration Proof		Vibration Frequency : 10~55HZ; Amplitude :1.5mm; Three directions :1H
10	Solder Ability : More than 80% of immersed part shall be covered with solder		Soldering Temperature :235±5℃ Immersing Time :2~3S
11	Solder Heat Resistance		Dip Soldering :260±5℃ 5±1S Manual Soldering : 300±5℃ 2~3S
12	Safety Approvals		UL、CSA、VDE、ENEC、TUV、CE、KC、CQC
13	Test Conditions		Ambient Temperature :20±5℃ Relative Humidity :65±5%RH Air Pressure :86~106KPa