Micro Switch For Equipments bend Lever

Micro Switch For Equipments bend Lever has a small contact interval and a quick action mechanism, and the contact mechanism for switching action with the specified stroke and force is covered by the shell, and there is a transmission on the outside, and the shape is small

Model:HK-04G-5871

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Product Description

WEIPENG® is a leading Micro Switch For Equipments bend Lever manufacturers, suppliers and exporter.

Tongda Micro Switch For Equipments bend Lever Introduction

Micro switches can be found in barcode scanners and readers, providing reliable switching for different functions.They are employed in industrial weighing scales and equipment, providing control and feedback on weight measurements.They are used in firefighting equipment, ensuring reliable control and operation of valves and pumps.

Tongda Micro Switch For Equipments bend Lever Application

Micro switches are widely used in various fields. The following are several main application areas: Electronic equipment: Micro switches are often used in electronic equipment, such as computers, mobile phones, tablets, etc. They can be used to control power switches, function keys, volume buttons, and more. Home appliances: Micro switches are also widely used in home appliances, such as TVs, air conditioners, washing machines, refrigerators, etc. They can be used to control electrical switches, protection devices, etc.

Switch Technical Characteristics:
ITEM	Technical Parameter		Value
1	Electrical Rating		5(2)A 125V/250VAC 10(3)125V/250VAC
2	Contact Resistance		≤50mΩ Initial value
3	Insulation Resistance		≥100MΩ (500VDC)
4	Dielectric Voltage	Between non-connected terminals	500V/0.5mA/60S
		Between terminals and the metal frame	1500V/0.5mA/60S
5	Electrical Life		≥10000 cycles
6	Mechanical Life		≥100000 cycles
7	Operating Temperature		-25~125℃
8	Operating Frequency		Electrical :15 cycles Mechanical :60 cycles
9	Vibration Proof		Vibration Frequency :10~55HZ; Amplitude :1.5mm; Three directions :1H
10	Solder Ability : More than 80% of immersed part shall be covered with solder		Soldering Temperature : 235±5℃ Immersing Time :2~3S
11	Solder Heat Resistance		Dip Soldering :260±5℃ 5±1S Manual Soldering :300±5℃ 2~3S
12	Safety Approvals		UL、CSA、VDE、ENEC、CE
13	Test Conditions		Ambient Temperature :20±5℃ Relative Humidity :65±5%RH Air Pressure : 86~106KPa