Microwave Oven Door Micro Switch Low Force

Microwave Oven Door Micro Switch Low Force is offered by China manufacturers WEIPENG®. Our competitive pricing and popularity in the European and American markets make us an ideal long-term partner for your Household appliances ultra-small micro switch needs in China.

Model:HK-04G-LZ-004

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Product Description

WEIPENG® is a leading China Microwave Oven Door Micro Switch Low Force manufacturers, suppliers and exporter.

Tongda Microwave Oven Door Micro Switch Low Force Introduction

The microswitch can basically change the contact at the same position even if the open/close operation process is continuous, so the position detection error is small, and it can be used in the scope of application that requires precision machining. This is also a unique advantage of microswitches with a snap-action mechanism.

Applications such as computer mice, car mice, automotive electronic products, communication equipment, military products, testing instruments, gas water heaters, gas stoves, small household appliances, microwave ovens, rice cookers, float equipment, medical equipment, building automation, power tools and general electrical and radio equipment, 24-hour timers, etc.

Tongda Microwave Oven Door Micro Switch Low Force Parameter (Specification)

Switch Technical Characteristics:
ITEM	Technical Parameter		Value
1	Electrical Rating		5(2)A 125V/250VAC 10(3)125V/250VAC
2	Contact Resistance		≤50mΩ Initial value
3	Insulation Resistance		≥100MΩ (500VDC)
4	Dielectric Voltage	Between non-connected terminals	500V/0.5mA/60S
		Between terminals and the metal frame	1500V/0.5mA/60S
5	Electrical Life		≥10000 cycles
6	Mechanical Life		≥100000 cycles
7	Operating Temperature		-25~125℃
8	Operating Frequency		Electrical :15 cycles Mechanical :60 cycles
9	Vibration Proof		Vibration Frequency :10~55HZ; Amplitude :1.5mm; Three directions :1H
10	Solder Ability : More than 80% of immersed part shall be covered with solder		Soldering Temperature : 235±5℃ Immersing Time :2~3S
11	Solder Heat Resistance		Dip Soldering :260±5℃ 5±1S Manual Soldering :300±5℃ 2~3S
12	Safety Approvals		UL、CSA、VDE、ENEC、CE
13	Test Conditions		Ambient Temperature :20±5℃ Relative Humidity :65±5%RH Air Pressure : 86~106KPa