Waterproof Micro Switch For ATM Machines

Waterproof Micro Switch For ATM Machines has a small contact interval and a quick action mechanism, and the contact mechanism for switching action with the specified stroke and force is covered by the shell, and there is a transmission on the outside, and the shape is small.

Model:FSK-20-151

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Product Description

WEIPENG® is a leading Waterproof Micro Switch For ATM Machines manufacturers, suppliers and exporter.

Tongda Waterproof Micro Switch For ATM Machines Introduction

Waterproof micro switch is a kind of micro switch with waterproof performance, which is often used in electronic equipment, household appliances, automotive electrical appliances and other fields.

Waterproof micro switches are usually made of waterproof materials, such as high temperature resistant plastics, stainless steel, etc. It is temperature stable and can work well in high or low temperature environments.

Tongda Waterproof Micro Switch For ATM Machines Application And Specification

Waterproof micro switches are suitable for the following fields: Household and construction fields. Industrial field. Automotive and transportation fields. Water conservancy and environmental protection field. Medical and health field 。Waterproof Micro Switch has a wide range of application fields.

Switch Technical Characteristics:
ITEM	Technical parameter		Value
1	Electrical Rating		0.1A/1A/3A 250VAC
2	Operating Force		1.0~2.5N
3	Contact Resistance		≤300mΩ
4	Insulation Resistance		≥100MΩ (500VDC)
5	Dielectric Voltage	Between non-connected terminals	500V/0.5mA/60S
		Between terminals and the metal frame	1500V/0.5mA/60S
6	Electrical Life		≥50000 cycles
7	Mechanical Life		≥100000 cycles
8	Operating Temperature		-25~105℃
9	Operating Frequency		Electrical :15 cycles Mechanical :60 cycles
10	Vibration Proof		Vibration Frequency :10~55HZ; Amplitude : 1.5mm; Three directions :1H
11	Solder Ability :More than 80% of immersed part shall be covered with solder		Soldering Temperature : 235±5℃ Immersing Time :2~3S
12	Solder Heat Resistance		Dip Soldering :260±5℃ 5±1S Manual Soldering :300±5℃ 2~3S
13	Test Conditions		Ambient Temperature :20±5℃ Relative Humidity :65±5%RH Air Pressure :86~106KPa